Packaging Service
Multi - Layer Wire Bonding
- Automated wire bonding
- High-density multi-layer wire connection
- Pad design requirement:
- Pad size ≥ 70×70μm
- Pad pitch ≥ 100μm
Four-layer wire bonding
Bandlet bonding
Deep cavity wire bonding
Deep cavity wire bonding
Hybrid Integration PIC Packaging
- Surface grating coupling
- Large channel number coupling is achieved between waveguide grating and fiber array
- Edge butt-coupling
- High efficiency coupling is achieved through waveguide spot size converters (SSCs)
- Lens-assisted coupling
- Laser diode—lens—PIC chip
- Lens is used for mode conversion, with a coupling efficiency of ~60%-80%
Laser diode – single/dual lens (with isolator) – silicon photonic chip
Semiconductor gain chip – silicon photonic chip
Single-side 81-ch FA coupling
High - Speed RF Packaging
High-Frequency PIC Packaging (Bandwidth > 40GHz)
- Based on the chip electrode layout, design the
evaluation circuit board and RF connector
selection - The circuit board reserves reference transmission
lines for performance test
Temperature Control and Hermetic Package
Thermal design of heat sink
- Perform thermodynamic modeling and simulation, and design the heat sink and TEC selection.
- For high-power chips, water cooling can be designed.
Customized Hermetic Packaging
- Provide a highly controlled and protected environment for the PIC (including high speed PIC)
Transform Your Vision Into Reality
Where Light Becomes the Language of Tomorrow
Partner with Senphoton for cutting-edge photonic solutions. Let’s take your PIC design from concept to production.